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New development kit and system-in-package enable shorter time to market and support design of high volume IoT products.
January 7, 2020
By: DAVID SAVASTANO
Editor, Ink World Magazine
Flex, in collaboration with QuickLogic Corporation and Infineon Technologies AG, an-nounced the availability of the FLEXino Sensor Fusion Development Kit to enable rapid prototyping and a corresponding 12mm x 12mm System-in-Package (SiP) for high volume production of Internet of Things (IoT) devices. To help reduce time to market and scale production, the development kit and SiP enable a wide range of new and existing sensor fusion IoT products requiring audio, pressure and motion sensing, Blue...
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